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Automatic SMT Wave soldering 300

Automatic SMT Wave soldering 300

Model Number
Regular price $24,000.00 USD
Regular price $25,000.00 USD Sale price $24,000.00 USD
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Product Description

 

 

 

SPECIFICATIONS

ITEMS

MODEL

Control style

BUTTION+PLC (GRANDSEED PCBASE WAVE SOLDERING CONTROL SOFEWARE V1.0)

Conveying motor

1P  AC220V,60W

Conveying speed

0 ~ 2000 mm/min

PCB size

30 ~ 300 mm (W)

Flux capacity

6L

Pre-heating zone

1300mm, 3 sections PID controlled individual hot air, zone temperature 250

Solder pot temperature

1 KW * 9PCS  zone temperature 300

Solder pot capacity

≈195KG

Solder wave height

0~12MM

Solder wave motor

3P  AC220V,0.18KW*2PCS

Finger cleaning pump

1P  AC220V 6W

Conveying direction

Left→Right

Soldering angle

3~6 º

Flux pressure

3~5  BAR

Power supply

AC380V 50HZ

Normal working power/total power

5 KW / 18 KW

Outside dimension

3560(L)*1200(W)*1650(H)

Machine dimension

2700(L)*1200(W)*1650(H)

Net weight

890 KG

 

 

Features of GSD-WD300R Soldering series

 

Button based control system, intuitive operating interface,, Grandseed independent research and development PCBASE wave soldering control software V1.0 system,significantly increased the work efficiency and decreased the production cost.

-Fully automatic transportation power system, stepless frequency conversion speed regulation, automatic synchronous board feeding, and PCB board automatically entering the spray system.

 

-Automatically start soldering when PCB enters soldering pot zone, and automatically stop when finished.(Patent No.:ZL 2010 2 0056206.3)

-The machine adopts lead-free environmentally friendly independent design, which is convenient and safe in going up and down as well as going in and out, and is easy to clean.

-The machine adopts high grade imported stainless steel, and aluminum silicate for thermal insulation material, when the temperature inside of the solder pot is 270, outside temperature≤60, which means good heat preservation effect and extremely high security.

-3mm thick lead-free stainless steel material, resistant to high temperature and corrosion, suitable for lead-free processes, with a long service life; Comes with a standard furnace liner.

-The machine adopts a 5-sided heating method, with fast heating and automatic on/off time design. The tin furnace can be produced within 70 minutes of heating time

-The solder pot adopts imported high-temperature motors, stepless frequency conversion speed regulation, independent control, and stable peak performance;

-The heating of the solder pot adopts a high-speed PID external heating two-stage independent control, which heats up quickly and solves the problem of tin explosion in the tin furnace;

-The spray nozzle of solder pot can be adjusted according to the width of the PCB board you want to pass through, reducing the area of ineffective welding and minimizing the contact area between solder and air, greatly reducing the oxidation of solder. The tin bars contain different impurities, and there may be deviations in the tin slag. Suitable for various lead-free solder materials such as Sn/Zn and Sn/Cu, with tin slag oxidation rate within 0.8-2.0KG every 8 hours (depending on the size of the PCB board) The machine increase diversion channels and anti oxidation sleeves to reduce black powder and tofu residue like oxides.

-The design is reasonable, and the tin slag is automatically collected. Cleaning the tin furnace is simple, convenient, and safe, without the need to scoop up the tin slag every day. It can be cleaned once a week or longer according to the situation.

 

 

 

 

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